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Our wafer dicing service utilizes a Disco DFD 651 Automatic Dicing Saw. The dual spindle with revolutions up to 60,000 RPM allow for quick dicing reducing the time it takes to dice a wafer and ultimately cost. This machine can handle substrates up to 25 x 8″ rounds at a time.
  •    Number of streets — Both X and Y
  •    Street size — Our standard blades for silicon cut approximately 60 um including chipping
  •    Chipping spec — Chipping depends on coating surface, cutting parameters and blade type
  •    Size of substrate — Diameter and thickness
  •    Substrate Material
  For more information about the superior results our dicing services can achieve, we invite you to call us at +1 858-566-2945 or submit an inquiry via our web form.

Advanced International Technology specializes in precision wafer dicing services with high fidelity and rapid turnaround time.

AI Technology serves clients throughout San Diego, Chula Vista, National City, Mission Valley, Miramar, Mira Mesa, San Jose & San Francisco, CA and surrounding cities.

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Contact our experts today for more information about our dicing and assembly services.

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